Call for Papers

Posted on 2024-06-20

We are excited to announce that the Emerging Technologies and Engineering Journal (ETEJ) is inviting submissions for its second issue, scheduled for publication in December 2024. ETEJ aims to serve as a premier platform for the dissemination of groundbreaking research, innovations, and developments in the field of emerging technologies and engineering. We welcome contributions that challenge conventional paradigms, propose innovative solutions, and foster the advancement of knowledge in our field.

Themes and Topics of Interest: We are seeking original, high-quality papers that explore, but are not limited to, the following themes:

  • Artificial Intelligence and Machine Learning Applications
  • Robotics and Automation
  • Architecture and Civil Engineering
  • Sustainable and Green Technologies
  • Bioengineering and Biomedical Technologies
  • Cybersecurity and Blockchain Technology
  • Advanced Materials and Nanotechnology
  • Internet of Things (IoT) and Smart Systems
  • Technology in Education
  • Data Science and Big Data Analytics
  • Quantum Computing

Submission Guidelines:

  • Papers should be original work, not previously published, and must adhere to the journal's formatting and submission guidelines found on our website.
  • Submissions will undergo a rigorous peer-review process, ensuring the highest standards of scholarly excellence.

Publication Benefits:

  • Be a part of the inaugural issue of a journal poised to become a leader in the field of emerging technologies and engineering.
  • Gain visibility and recognition for your research among a global audience of scholars and practitioners.
  • Contribute to the advancement of cutting-edge technologies and engineering practices.

How to Submit: Please visit our submission portal to submit your full paper. Ensure that you comply with all submission guidelines and formatting requirements.

We are looking forward to your contributions to making the Emerging Technologies and Engineering Journal issue a cornerstone in engineering and technology research. Should you have any inquiries, please do not hesitate to contact us at etej@engiscience.com.

 

Dr. Hozan Latif Rauf

Editor-in-Chief